Chip bonding, as a core process in semiconductor packaging, directly depends on the precise monitoring and control of oxygen content for bond yield, interface reliability, and long-term chip stability. Whether it is conventional copper wire bonding, gold wire ball bonding, or advanced TCB thermocompression bonding and hybrid bonding, excessive oxygen content can lead to metal oxidation, reduced bond strength, and interface voids, among other fatal defects. As a leading enterprise in industrial gas detection, Shanghai GaoChuan has been deeply involved in the field of oxygen monitoring for semiconductor bonding equipment. The company has launched the vacuum zirconia oxygen analyzer OXY-GC-169 and the high-precision ionization oxygen gauge OXY-GC-179, forming a comprehensive solution for all scenarios, ensuring the stability of the bonding process and injecting core power into semiconductor manufacturing. Among them, the Shanghai GaoChuan OXY-GC-169, with its high cost-effectiveness and stability, has become the preferred configuration for most bonding equipment manufacturers.

In medium and low vacuum bonding scenarios (such as copper wire bonding and gold wire ball bonding), the Shanghai GaoChuan OXY-GC-169 vacuum zirconia oxygen analyzer demonstrates unique advantages and serves as the "precise oxygen control guardian" for bonding equipment. The OXY-GC-169 adopts advanced LT zirconia sensor technology, achieving efficient oxygen ion conduction at high temperatures of 600-850°C. It accurately converts the oxygen partial pressure based on the electromotive force generated by the oxygen partial pressure difference, and directly outputs data without the need for additional equipment. For medium and low vacuum conditions (>10-3 Pa) in bonding equipment, the OXY-GC-169 automatically switches between a wide range of 1ppm to 25% VOL, with a measurement accuracy of ±3ppm@1-99.9ppm, a T90 response time of less than 5 seconds, and a preheating time of only 3 minutes. It can quickly capture oxygen concentration fluctuations and promptly adjust the protective gas supply to prevent oxidation of the metal bonding surface. Additionally, the OXY-GC-169 is equipped with a KF40 flange vacuum seal interface, with an IP65 protection level that can adapt to the complex working conditions of bonding equipment, resisting dust and water vapor interference. The sensor has a lifespan of 3-5 years and extremely low maintenance costs, perfectly matching the mass production needs of conventional bonding equipment and becoming one of Shanghai GaoChuan's core products for empowering semiconductor packaging.

For advanced bonding processes (such as TCB thermocompression bonding and hybrid bonding), ppb-level oxygen content monitoring in high/ultra-high vacuum environments (<10-3 Pa) is crucial. Shanghai GaoChuan has launched the high-precision ionization oxygen gauge OXY-GC-179 to complement the OXY-GC-169, forming a comprehensive oxygen control system for all working conditions. The OXY-GC-179 ionization oxygen gauge uses highly sensitive ionization technology, combining a hot cathode to emit electrons that collide with gas molecules to achieve ionization. By screening the oxygen ion flow, it precisely detects the oxygen partial pressure, with a measurement range of 10-9 to 10-1 Pa, easily achieving ppb-level oxygen content monitoring, fully meeting the strict requirements of advanced processes such as hybrid bonding, which demand <1ppm. Compared to the OXY-GC-169, the ionization oxygen gauge is more focused on precise monitoring in ultra-high vacuum scenarios, with strong stability and outstanding anti-interference capabilities. It can be linked with the vacuum gauge of the bonding equipment, and through the formula "oxygen partial pressure ÷ total pressure × 10⁶", it can calculate the oxygen content in ppm in real time, providing precise data support for advanced bonding processes and helping enterprises increase the bonding yield to over 99%.

As a high-tech enterprise deeply involved in the semiconductor detection field, Shanghai GaoChuan always takes process requirements as the guide, deeply adapting the OXY-GC-169 vacuum zirconia oxygen analyzer and the OXY-GC-179 ionization oxygen gauge to different working conditions of bonding equipment, forming a scientific solution of "select OXY-GC-169 for conventional processes and OXY-GC-179 for advanced processes". Shanghai GaoChuan's OXY-GC-169 not only features precise detection and rapid response, but also supports 4-20mA signal output and RS-485 communication protocol, enabling seamless integration with the DCS system of bonding equipment for real-time data upload and closed-loop control of oxygen content, thus facilitating the establishment of an intelligent monitoring network for enterprises. Meanwhile, the OXY-GC-179 ensures long-term monitoring accuracy through regular calibration and filament maintenance, and is complemented by Shanghai GaoChuan's professional technical service team, which provides full life-cycle support from equipment selection, installation and commissioning to later operation and maintenance training, eliminating the worries of enterprises.

Currently, semiconductor packaging is evolving towards higher density, higher reliability, and miniaturization, and the bonding process demands higher precision, range, and stability in oxygen content monitoring. Relying on years of technological accumulation, Shanghai GaoChuan fully leverages the advantages of the OXY-GC-169 and the ionization oxygen gauge. The OXY-GC-169 meets the mass production needs of conventional bonding equipment with its high cost-effectiveness, while the OXY-GC-179 caters to the upgrading requirements of advanced packaging processes, creating a differentiated competitive edge. The collaborative application of the Shanghai GaoChuan OXY-GC-169 and the ionization oxygen gauge not only resolves the core pain points of oxygen content monitoring in bonding equipment but also helps enterprises reduce maintenance costs, improve product yield rates, and promote the high-quality development of the semiconductor packaging industry.

In the future, Shanghai GaoChuan will continue to focus on the semiconductor detection field, constantly optimize the performance of the OXY-GC-169 vacuum zirconia oxygen analyzer and the OXY-GC-179 ionization oxygen gauge, and in line with the technological upgrade trends of bonding equipment, introduce more customized solutions that meet industry demands. With precise oxygen control technology, it will empower the chip bonding process, assist China's semiconductor industry in breaking through technological bottlenecks, and achieve self-reliance and control. Choose Shanghai GaoChuan, and make every bonding process precisely controllable, ensuring every chip is stable and reliable!