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The Application of Oxygen Analyzers in Semiconductor Equipment
The measurement of oxygen content in semiconductor pressure/vacuum ovens is a crucial step, which is vital for ensuring the quality and performance of products. Generally, the measurement of oxygen content in semiconductor pressure/vacuum ovens is usually carried out using zirconia oxygen probes. This sensor operates based on the principle of oxygen ion migration in solid electrolytes and can accurately measure the oxygen content inside the oven. It ensures that the equipment is stably controlled within 20 ppm and can detect as low as 0.01 ppm.
Connect the zirconia oxygen probe to the vacuum oven through an appropriate interface, ensuring a tight connection without any gas leakage. Turn on the fan inside the oven (if equipped) to promote the mixing and uniform distribution of gases. Introduce high-purity nitrogen or other inert gases, and control the gas flow through the pressure reducing valve and cylinder valve. Continuously monitor the oxygen concentration inside the oven until it drops to a sufficiently low level (such as around 20 ppm). Shut off the nitrogen source and the fan, then turn on the vacuum pump to reduce the pressure inside the oven to the required test pressure (such as -2000 Pa). Turn off the vacuum pump and wait for a period of time to allow the gas pressure inside the oven to stabilize.
Sensor selection: Choose the appropriate zirconia oxygen sensor to ensure that its measurement range, accuracy and response time meet the measurement requirements. For example, the OXY-GC-168 oxygen analyzer, with a measurement range of 0.01ppm - 20.75%, a temperature resistance of 600℃ and a pressure resistance of -0.1Mpa to +1Mpa, is very suitable for this application environment.
Through the above methods and steps, the oxygen content in the vacuum oven can be precisely measured, providing strong support for product quality control and process optimization.
